Ricky

PomTum Pal: Your Ideal AI Box to Use & Work on

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For the purpose of providing developers with a more powerful and more user-friendly dev tool for the creation work, especially AI dev work, we kicked off the project in Dec last year as the 1st user to adopt Qualcomm Dragonwing QCM6690 SoC, which is one of the latest SoCs from Qualcomm and was not even publicly announced by then.

In CES 2025, Mecha Comet made a hit in the crowds for its modular and portable design, which also gave us more confidence in developing Pal, because Pal has modular design too, though its definition or use cases are quite different from that of Mecha Comet.

After a year's preparation, now we are glad to announce that we will soon launch it on Kickstarter campaign, and we will be providing two reward tiers for developers to choose from: Pal itself(the AI box) and Pal's motherboard(the SBC).

Should you have any interest, come and back our campaign.

Here are the specs of Pal:

SoC                  QCM6690 FP4
Display             5-inch FHD touch screen
OS                    Android 16
Memory           12GB LPDDR5 + 256GB UFS 3.1
Connectivity     5G/Wi-Fi 7/BT 6.0/GNSS/NFC
Battery             2850mAh li-ion
Peripherals       1*receiver, 1*speaker, 2*DMIC
Keys                 Power/ Volume key/ Home key with finger print unlock
I/O ports           1*Type-C with DP, 2*80-pin extension connectors (I2C*5, GPIO*6, PCIE*1, CSI*4, Fan*1)
Others              Nano SIM+TF slot

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